Transit Case and Rack System Integration

M1U20XX FAMILY 1U MILITARY GRADE CONFIGURED RACKMOUNT SYSTEMS


image1U x 20.0-inches Rugged Mil Grade Chassis
imageExtended-life Motherboard Options with
       Long Life Processors

imageEATX Motherboard (Proprietary Form Factor)
imageSingle and Dual 8 or 10 Core XEON E5 CPU's

imageTwo x16 (Gen 3.0) Card Slots
imageUp to Three 2-1/2" Removable Drives, Removable and
       One Slim DVD
imageFive Fans w/ SysCool® Intelligent Fan Controller

imageHigh Reliability 100K hour aluminum body fans

imageFront Panel Smart Card Reader (Optional)
imageRedundant Power Supply
imageFront Door with Air Filter
imageAssembled in the USA

 
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HARSH ENVIRONMENTS
Designed to meet or exceed MIL-STD-810G to the
below specifications.

ALTITUDE

12,000 ft. Operational

40,000 ft. Storage

Method 500.5

 

HIGH TEMPERATURE

45°C Operational

70°C Storage

Method 501.5

 

LOW TEMPERATURE

0°C Operational

-40°C Storage

Method 502.5

 

HUMIDITY

5-95%, Non-condensing

Method 500.7

 

TRANSPORT VIBRATION

US Highway Truck and Air Transport

Method 514.6

 

BENCH HANDLING SHOCK

Procedure VI, 20G @ 11mS

Method 516.6

The M1U2012 is designed for those seeking a rugged rack mount system designed to perform in confined spaces. Need a unit with high-computational speed for military applications? Chassis Plans utilizes the ruggedized 1U chassis that is designed to meet or exceed the testing requirements of MIL-STD 810G. This enclosure is constructed of aircraft-grade aluminum with a milled aluminum front panel for exceptional strength and low mass. Self-locking stainless-steel hardware is used throughout to ensure system integrity during sudden shock and vibration events.  Offered with a front door with installed air and EMI filter, this feature serves to protect the drive bays and other components from dust and dirt, as well as shielding against MIL-STD-461F EMI radiation. Behind the front door are (3x) shock-isolated removable 2.5” hard drive carriers. Up to (2x) PCI-e x16 (Gen 3.0) add-in boards are secured with a fixed, bulkhead-mounted riser card and customized Delrin blocks – all designed to secure and stabilize the cards.

 

The chassis utilizes the Chassis Plans SysCool® thermal management system, which consists of our intelligent SysCool thermal management board, (5x) high MTBF 40 mm cooling fans, and strategically placed thermistors for proper system temperature monitoring. The intelligent SysCool thermal board monitors strategic thermal locations and throttles the cooling fans up or down depending on system thermal requirements. This technology extends the life of the fans, reduces power consumption, and lowers overall system noise levels. The fans are high reliability 100,000 hour aluminum body.

 

Built-in component redundancy complements the ruggedized construction and thermal management properties of this high performance computing platform. Components with moving parts, such as power supplies, cooling fans and hard drives, are all engineered with standard system redundancy. Both the power supply and hard drives have hot swap capabilities for true 24/7 up time.

 

The M1U2012 contains a revision-controlled, long-life, high-performance system board that utilizes the latest Intel® C606 chipset. This new chipset cuts I/O latency by up to 30%, while adding capacity and 2x the bandwidth of previous generations. Up to (2x) Intel® embedded Xeon® E5 series CPU’s (E5-2658 or E5-2620) can be installed. The E-2600 delivers an 80% performance boost over previous Xeon® generations at constant power levels and can include up to (8x) cores and 20MB of on board cache. This new architecture also provides increased system memory capacity, offering up to 512GB of ECC on-board memory. Each of the installed system components have been selected and tested to ensure the utmost in reliability and long program life availability.

 

Clients can add a variety of add-in boards and software, giving this platform an almost unlimited application potential. Offering a shallow depth enclosure, this system is designed for use in transit case installation, as well as shallow depth fixed racks. Along with the aforementioned features, Chassis Plans rugged systems are always fully customizable - both the mechanically or electrically. Your dedicated Chassis Plans sales engineers will be able to help tailor a customized solution for your application.



Model
Number

Processor
Speed
GHz
Number
Of CPUs


Chip Set

Max Ram
(GB)

Raid
Slot Count
(Dependant on Riser)
image
M1U2012 XEON
E5-2658
2.10
10 Cores
1 or 2 C606
512 JBOD
0, 1, 5

PCIe - 2x16 (Gen 3.0)

  XEON
E5-2428L
1.8
8 Cores
1 or 2 C606
512 JBOD
0, 1, 5

PCIe - 2x16 (Gen 3.0)


A Redundant 600W power supply and slim DVDRW are standard.

System Features

Physical Dimensions

1U - 1.75" (H) x 19" (W) x 20.0" (D)
(44.5 mm x 482.6 mm x 508.0 mm)

 

Weight

20 lbs fully configured (weight varies by configuration)

 

Power Supply

Output Power 600W

Redundant configuration

Input 100 to 240VAC, 50/60Hz auto switching high efficiency

Other options available

 

Cooling

5x 40mm fans, 18CFM each, mounted mid-chassis

Fans are aluminum body 100,000 hour MTBF

Air filter mounted in front door.

SysCool® Intelligent Fan Control and Alarm Board

High reliability 100,000 hour MTBF aluminum body fans


Front Panel Details

Power On/Off Momentary switch, System Reset Switch

2x USB

LEDs - Power On, HDD Activity, Fan Fail, Over Temp, Alarm

Single front door w/ 4 thumbscrews, air filter in door

 

Drive Bays

4x 3-1/2" Hard Drive Bays

Drive are Shock Mounted

Slim DVDRW installed standard

 

Expansion Slots

2x PCIe x16 (Gen 3.0)

 

Environment

Operating Temperature: 0 to 45 deg C

Storage Temperature: -40 to 70 deg C

Humidity: 5 to 95% RH Non-condensing

 


Model Highlights

M1U2012 - XEON E5, C606 Chipset (2 x16 PCIe Slots)

HIGHLIGHTS

  • Long Life Revision Controlled Components used throughout
  • Processor -
            Single or Dual XEON E5-2658, 8-core, at 2.4GHz, 8.0GT/s (on Intel Road Map) or
            Single or Dual XEON E5-2428L, 6-core, at 1.80GHz, 7.2 GT/s (on Intel Road Map)
  • C606 Chipset
  • Up to 512GB RAM
  • On-board video or choice of video card
  • 3x 2-1/2" shock mounted drive bays and 1x slim DVD. Installed standard is a slim DVDRW and a single fixed 500GB HD. (other drives, fixed or removable, optionally available)
  • RAID 0, 1, 5 10 or JBOD
  • 2 x16 PCIe slots
  • Slim DVDRW drive standard
  • XP Embedded or Win7 Operating Systems (Other OS optionally available)

MOTHERBOARD DETAILS

PROCESSOR

  • Dual Socket R (LGA 2011) for:
        XEON E5-2658, 10-core, at 2.4GHz, 8.0GT/s
        XEON E5-2428L, 8-core, at 1.80GHz, 7.2GT/s

CHIPSET

  • Intel®C606 chipset

SYSTEM MEMORY

  • 16x 240-pin DIMM sockets
  • Supports up to 512GB DDR3 800/1066/1333/1600 MHz ECC Registered
  • Supports up to 128GB DDR3 ECC / Non ECC Unbuffered

EXPANSION SLOTS

  • 2 PCI Express x16 slots (Gen 3.0)

ONBOARD GRAPHICS FEATURES

  • G200 (Renesas DH7757 BMC)

ONBOARD AUDIO

  • No on-board audio

ONBOARD LAN FEATURES

  • One Intel i350 Dual-Port Gigabit Ethernet Controller (2 rear RJ45 ports)
  • Supports 10Mbps, 100Mbps and 1Gbps data transmission
  • One Realtek RTL8211 dedicated IPMI LAN Port

SERIAL ATA INTERFACE

  • Supports up to 6 drives
  • Supports RAID 0, 1, 5 and 10 (Windows)
  • Supports RAID 0, 1, 10 (Linux)

REAR PANEL I/O PORTS

  • 1 DB-9 RS232 serial port
  • 1 DB15HD VGA port
  • 2 RJ45 LAN ports
  • 4 USB 2.0/1.1 ports
  • 1 RJ45 IPMI_LAN


Intelligent Platform Management Interface v.2.0

  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
  • Winbond WPCM450 BMC


I/O CONNECTORS

  • 1 connector for 2 additional external USB 2.0/1.1 ports (6 total ports)
  • 1 connector for external RS232 serial ports
  • Power Supply SMBbus I2C Header
  • 6 Serial ATA connectors (2 6Gbps and 4 3Gbps)
  • 1 24-pin ATX power connector
  • 1 8-pin Secondary power connector
  • 1 chassis intrusion connector
  • 1 front panel connector
  • 6 fan connectors
  • Serial General Purpose I/O Headers for SATA
  • Variety of LED Headers (Overheat, Power, BMC Heartbeat, Standby)

BIOS

  • AMI BIOS
  • 128Mbit flash memory

ENERGY EFFICIENT DESIGN

  • Supports ACPI specification 3.0
  • Wake-On-Events include:
    • Wake-On-PS/2 Keyboard/Mouse
    • Wake-On-USB Keyboard/Mouse
    • Wake-On-LAN
  • System power management supported
  • Soft Power supported - ACPI specification
  • AC power failure recovery

DAMAGE FREE INTELLIGENCE

  • Monitors CPU/system temperature and overheat alarm
  • Monitors CPU/DIMM/3.3V/5V/12V/Chipset Vcore/VBAT voltages and failure alarm
  • Monitors fan speeds and failure alarm

TEMPERATURE

  • Operating - 10C to 35C
  • Non-Operating - -40C to 70C

HUMIDITY

  • 8% to 90%

PCB

  • Proprietary EATX form factor
  • 305mm (12") x330mm (13")

REGULATORY

  • FCC Class A



X9DRW-3F Rear IO

 

X9DRW-3F Motherboard Manual

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By David Lippincott