The M1U2012 is designed for those seeking a rugged rack mount system designed to perform in confined spaces. Need a unit with high-computational speed for military applications? Chassis Plans utilizes the ruggedized 1U chassis that is designed to meet or exceed the testing requirements of MIL-STD 810G. This enclosure is constructed of aircraft-grade aluminum with a milled aluminum front panel for exceptional strength and low mass. Self-locking stainless-steel hardware is used throughout to ensure system integrity during sudden shock and vibration events. Offered with a front door with installed air and EMI filter, this feature serves to protect the drive bays and other components from dust and dirt, as well as shielding against MIL-STD-461F EMI radiation. Behind the front door are (3x) shock-isolated removable 2.5” hard drive carriers. Up to (2x) PCI-e x16 (Gen 3.0) add-in boards are secured with a fixed, bulkhead-mounted riser card and customized Delrin blocks – all designed to secure and stabilize the cards.
The chassis utilizes the Chassis Plans SysCool® thermal management system, which consists of our intelligent SysCool thermal management board, (5x) high MTBF 40 mm cooling fans, and strategically placed thermistors for proper system temperature monitoring. The intelligent SysCool thermal board monitors strategic thermal locations and throttles the cooling fans up or down depending on system thermal requirements. This technology extends the life of the fans, reduces power consumption, and lowers overall system noise levels. The fans are high reliability 100,000 hour aluminum body.
Built-in component redundancy complements the ruggedized construction and thermal management properties of this high performance computing platform. Components with moving parts, such as power supplies, cooling fans and hard drives, are all engineered with standard system redundancy. Both the power supply and hard drives have hot swap capabilities for true 24/7 up time.
The M1U2012 contains a revision-controlled, long-life, high-performance system board that utilizes the latest Intel® C606 chipset. This new chipset cuts I/O latency by up to 30%, while adding capacity and 2x the bandwidth of previous generations. Up to (2x) Intel® embedded Xeon® E5 series CPU’s (E5-2658 or E5-2620) can be installed. The E-2600 delivers an 80% performance boost over previous Xeon® generations at constant power levels and can include up to (8x) cores and 20MB of on board cache. This new architecture also provides increased system memory capacity, offering up to 512GB of ECC on-board memory. Each of the installed system components have been selected and tested to ensure the utmost in reliability and long program life availability.
Clients can add a variety of add-in boards and software, giving this platform an almost unlimited application potential. Offering a shallow depth enclosure, this system is designed for use in transit case installation, as well as shallow depth fixed racks. Along with the aforementioned features, Chassis Plans rugged systems are always fully customizable - both the mechanically or electrically. Your dedicated Chassis Plans sales engineers will be able to help tailor a customized solution for your application.
|| Max Ram
| Slot Count
(Dependant on Riser)
|1 or 2||C606
0, 1, 5
PCIe - 2x16 (Gen 3.0)
|1 or 2||C606
0, 1, 5
PCIe - 2x16 (Gen 3.0)
1U - 1.75" (H) x 19" (W) x 20.0" (D)
20 lbs fully configured (weight varies by configuration)
Output Power 600W
Input 100 to 240VAC, 50/60Hz auto switching high efficiency
Other options available
5x 40mm fans, 18CFM each, mounted mid-chassis
Fans are aluminum body 100,000 hour MTBF
Air filter mounted in front door.
SysCool® Intelligent Fan Control and Alarm Board
High reliability 100,000 hour MTBF aluminum body fans
Front Panel Details
Power On/Off Momentary switch, System Reset Switch
LEDs - Power On, HDD Activity, Fan Fail, Over Temp, Alarm
Single front door w/ 4 thumbscrews, air filter in door
4x 3-1/2" Hard Drive Bays
Drive are Shock Mounted
Slim DVDRW installed standard
2x PCIe x16 (Gen 3.0)
Operating Temperature: 0 to 45 deg C
Storage Temperature: -40 to 70 deg C
Humidity: 5 to 95% RH Non-condensing
ONBOARD GRAPHICS FEATURES
ONBOARD LAN FEATURES
SERIAL ATA INTERFACE
REAR PANEL I/O PORTS
ENERGY EFFICIENT DESIGN
DAMAGE FREE INTELLIGENCE