XPI XEON SINGLE BOARD COMPUTER , TRENTON TECHNOLOGY SYSTEM HOST BOARD SINGLE BOARD COMPUTER
SINGLE BOARD COMPUTERS & ACTIVE / PASSIVE BACKPLANES
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FEATURES
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DESCRIPTION The XPI single board computer merges Chassis Plans innovative engineering and quick delivery manufacturing capability with the features of the Intel® Xeon™ processor and E7500 Chipset. The XPI also has dual Gigabit Ethernet, 4GB of DDR Memory and the option of additional high-speed I/O expansion via a hub interface. The result is a robust PCI/ISA SBC designed to meet your needs in a wide variety of high-speed, data-intensive applications. Download the XPI datasheet - Click Here |
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PROCESSOR Intel® Xeon™ processor 2.0GHz to 3.0GHz*  *higher
speeds as availableHYPER-THREADING TECHNOLOGY Intel's Hyper-Threading technology makes the Xeon processor appear as two logical processors. This feature delivers faster program execution by enabling simultaneous instruction processing using the two logical processors. CHIPSET Intel's E7500 Chipset provides support for a faster system bus, DDR memory with ECC and high-speed I/O expansion. SYSTEM BUS The Intel E7500 Chipset supports a system bus speed of 400MHz. BUS SPEED
AMIBIOS8 with built-in advanced CMOS setup for system parameters, peripheral management for configuring on-board peripherals, PCI-to-PCI bridge support and PCI interrupt steering. Supports flash devices for BIOS upgrading via floppy interface. Also provides integrated support for USB mass storage devices such as USB CD-ROM, CD-RW, etc. Custom BIOSs are available upon request. CACHE MEMORY The Xeon processor supports a 512K integrated on-die Advanced Transfer Cache (L2). The cache is an 8-way set associative cache running at full processor core frequency. The Execution Trace Cache (L1) is a 12K data cache that stores thousand of decoded micro-operations. The purpose of this L1 cache is to remove decoder latency from the processor's main execution path. The net result is increased processor performance. DDR200/266 MEMORY Double Data Rate (DDR) memory improves memory data speed performance in data-intensive applications. The DDR200/266 interface consists of two DDR memory channels coming from the Memory Controller Hub (MCH) with each channel connected to a separate memory module socket. The sockets may contain either PC1600 or PC2100 DIMMs. The DIMM sockets must contain the same size and type of ECC registered DDR module. The bandwidth of the DDR200/266 memory interface is 1600MB/s per channel. ERROR CHECKING AND CORRECTION The memory interface supports ECC modes via BIOS setting for multiple-bit error detection and correction of all errors confined to a single nibble. PCI BUS INTERFACE The PCI bus interface supports either a 32-bit or 64-bit PCI backplane interface running at either a 33MHz or 66MHz bus speed. ISA BUS The XPI provides a 16-bit ISA bus interface to the backplane for legacy ISA slots. SYSTEM HARDWARE MONITOR The Winbond W83783S chip supports hardware monitoring. The functions monitored are voltage, fan speed and temperature. The XPI hardware monitor software allows the user to program the monitor limits to provide a trigger point for the application software. This allows the application program to monitor these trigger points in order to send system alert messages or perform corrective action. FLOPPY DRIVE INTERFACE Supports up to two floppy disk drives in combinations of 360K to 2.88MB. SUPER XGA VIDEO INTERFACE The Intel CHIPS 69030 video interface has 4MB of on-chip memory and supports pixel resolutions up to 1280 x 1024. Software drivers are available for most popular operating systems. SERIAL INTERFACE The Super I/O controller supports two full-function serial ports with independently programmable baud rates. The controller has two high-speed, NS16C550 compatible, UARTs with Send/Receive 16-Byte FIFOs. The IRQ for each serial port has BIOS selectable addressing. |
DUAL ETHERNET INTERFACES - 10/100/1000 BASE-T The XPI's internal PCI-X bus, with a bus speed of 133HMz, connects to Intel's 82546EB Ethernet Controller chip. This feature provides high-speed dual Gigabit Ethernet on LAN ports 1 and 2. The XPI also supports existing 10Mb or 100Mb per second Ethernet networks over the same internal PCI-X bus. RJ-45 connectors located on the I/O bracket provide the mechanical interface to the Ethernet networks. EIDE ULTRA ATA/100 INTERFACES (DUAL) Dual high-performance PCI Bus Master EIDE interfaces are capable of supporting up to two IDE disk drives each in a master/slave configuration. The interface supports Ultra ATA/100 with synchronous ATA mode transfers up to 100MB per second. OPTIONAL I/O EXPANSION Optional I/O expansion mezzanine cards connect directly to the XPI's Memory Controller Hub (MCH) via Intel's Hub Link 2.0 interface. This feature provides fast (1GB/s) I/O connectivity for mezzanine expansion cards such as Chassis Plans's H2S2 Dual Ultra160 SCSI interface. Consult Sales for additional I/O expansion card availability. WATCHDOG TIMER The programmable watchdog timer provides a system reset with a total range of 1ms to 60 seconds. The programmable increments of the watchdog are 1ms, 10s and 60s. ENHANCED BI-DIRECTIONAL PARALLEL INTERFACE The parallel port interface is compatible with IBM PC/XT®, PC/AT®, PS/2™, Enhanced Parallel Port (EPP1.7, EPP1.9) and Extended Capabilities Port (ECP) modes of operation. Both the EPP and ECP modes are IEEE 1284 compliant. The parallel port has BIOS selectable addressing. KEYBOARD AND PS/2 MOUSE INTERFACES The mini DIN connector located on the I/O bracket provides an external interface for a PS/2 mouse and keyboard. A "Y" adapter plugged into the mini DIN connector allows the PS/2 mouse and keyboard to share the same port. Internal PS/2 mouse and keyboard headers are also available. A self-resetting fuse protects the +5V line of the keyboard and the mouse. POWER REQUIREMENTS Typical Values
-12V @ <100mA* * From Backplane via PICMG® Connector. # From ATX12V power supply or equivalent via P4 connector. The Xeon processor's power requirements created the need for an additional This external power supply should have a minimum wattage rating of at least 250W. The XPI also requires that 3.3V be applied to the backplane from the power supply. POWER FAIL DETECTION The XPI continuously monitors the incoming +5V and +3.3V power lines from the system backplane. If the 5V line drops below 4.75 volt or the 3.3V line drops below 2.97 volt, the XPI issues a hardware-reset command. This feature helps maintain control and allows the system to automatically restart. A two-pin header is available for applications that require an external reset switch. On-board power lines are also monitored in a similar fashion. BATTERY Built-in lithium battery for data retention of CMOS memory. TEMPERATURE/ENVIRONMENT
MECHANICAL Chassis Plans's engineers have devised a low-profile (2.05" height) active cooling system. The XPI's cooling system may cover up additional slots in a typical PCI/ISA passive backplane system. Overall dimensions for the XPI, including the active cooling system are 13.3"L (338mm) x 4.8"H (121.9mm) x 2.05"W (52.1mm). STANDARDS - IEEE P996, Personal Computer Bus Standard - PCI Local Bus Specification 2.2 - PICMG 1.0 Specification MEAN TIME BETWEEN FAILURES (MTBF) 154,000 POH (Power-On Hours) at 40° C., per Bellcore. |
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MODEL NAME: XPI |
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* Contact Chassis Plans for the latest
processor speed availability.
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H2S2 Mezzanine Card - Dual Ultra160 SCSI S6058-000 H2S2 |
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XPI Technical Reference - Click Here
XPI Reference Manual - Click Here
SBC Support Page (drivers, etc.) - Click Here
Single Board Computers