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Multi-Core
TQ9 Single Board Computer
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FEATURES
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SBC that supports
a wide variety of multi-core Intel® processors
including the long-life/embedded Dual-Core
Intel® Core™ 2 Processor E8400 (pending)
and the Intel® Core™ 2 Duo Processor
E6400 or E4300 |
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Intel® Q35 Express
chipset and the ICH9DO with built-in SATA
RAID support |
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Quad-core processor
options supported including the Intel® Core™
2 Processor Q9550 |
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PCI Express™
graphics-class SHB supports x16 video and
graphics cards or ADD2 cards |
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Direct connect
video option via the chipset's Intel® Graphics
Media Accelerator 3100 |
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Supports dual
channel DDR2-800 memory, 8GB maximum |
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Audio Codec interface
and analog audio port |
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Eight USB and
four SATA/300 (i.e. SATA II 300) on-board
ports |
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Integrated RAID
0,1,5 and 10 implementation support via
four on-board SATA/300 ports |
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Two eSATA II
and four USB backplane interfaces |
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Dual Gigabit
Ethernet ports plus one 10/100Base-T backplane
interface |
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DESCRIPTION
Chassis Plans' TQ9 is a graphics-class, PICMG®
1.3 single board computer (i.e. system host board)
that supports a wide variety of single-, dual-
and quad-core Intel® processors. New TQ9 I/O interface
capabilities include an audio codec interface,
two eSATA connections to the backplane and a dozen
USB interfaces. The Intel® Q35 MCH and Intel®
ICH9DO ICH deliver advanced features like a 1333MHz
system bus and SATA RAID. Plugging the TQ9 into
a PICMG 1.3 graphics-class backplane enhances
system design flexibility. A system designed with
the TQ9 supports option cards from x16 PCI Express
to legacy 32-bit/33MHz PCI cards.
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PROCESSOR
Intel® Core™ 2 Processor - E8xxx, Q9xxx
series
Intel® Core™ 2 Duo Processor - E4xxx, E6xxx
series
Intel® Pentium® Dual Core Processor - E2xxx series
Intel® Celeron® Processor - 4xx series
Processor Package: LGA775 socket
CHIPSET
The Intel® Q35 Express Chipset provides an advanced
internal video and graphics port along with a
separate x16 PCI Express interface. A dual-channel
DDR2-800 memory interface supports four DIMM sockets
and up to 8GB of system memory. The TQ9's ICH9DO
also provides x1 and x4 PCI Express interfaces
plus a 32-bit/33MHz PCI interface. Analog and
digital audio capability is built into the Chassis
Plans TQ9 via the ICH9DO.
ETHERNET INTERFACES
The TQ9 uses an internal x1 PCI Express link to
connect the I/O Controller hub to the dual-port
Gigabit Ethernet controller chip. This design
feature enables dual 10/100/1000Base-T Ethernet
interfaces on LAN 1 and LAN2. The LAN ports have
RJ-45 connectors on the I/O bracket to provide
the mechanical interfaces to the Ethernet networks.
PICMG® 1.3 BACKPLANE I/O
INTERFACES
The TQ9 enables the following PICMG 1.3 backplane
I/O connectivity via the SBC's edge connector
C:
- Four USB ports
- Two eSATA interfaces
- One 10/100Base-T Ethernet interface
FOUR SERIAL ATA/300 (i.e.
SATA II 300) PORTS
The primary and secondary Serial ATA (SATA) II
ports on the TQ9 board support four independent
SATA storage devices such as hard disks, DVD-RW
and CD-RW devices. SATA produces higher performance
interfacing by providing data transfer rates up
to 300MB per second on each port. The TQ9's ICH9DO
I/O Controller hub features Intel® Matrix Storage
Technology, which allows the ICH9DO's SATA controller
to be configured as a RAID controller supporting
RAID 0, 1, 5, and 10 implementations.
TWELVE USB INTERFACES
A total of twelve USB 2.0 interfaces are supported
by the TQ9. USB ports 0 and 1 are on the I/O bracket
and ports 2, 3, 4, 5, 6 and 7 have header connectors
on the TQ9. USB interfaces 8,9,10 and 11 are routed
directly to the TQ9's edge connector C for use
on a PICMG® 1.3 backplane.
DDR2-800 MEMORY
The DDR2-800 interface is a dual-channel interface
originating at the Memory Controller Hub, with
each channel terminating at two DIMM module sockets.
The TQ9 supports system memory transfer rates
of 800MHz using unbuffered, non-ECC PC2-6400 DIMMs.
The TQ9's four DIMM sockets support a maximum
memory capacity of 8GB. When using a single PC2-6400
DIMM, the peak memory interface bandwidth is 6.4GB/s,
and placing a PC2-6400 DIMM in each socket of
the two memory channels produces a TQ9 theoretical
peak memory bandwidth of 12.8GB/s.
NOTE: All memory modules must have gold contacts.
CACHE MEMORY (L2)
The quad-core Intel® Core™ 2 Q9xxx series
processors feature a level two (L2) cache memory
capacity of 12MB (2x6MB). The dual-core Intel®
Core™ 2 E8xxx series of processors support
an L2 cache memory size of 6MB.
The dual-core Intel® Core™ 2 Duo Processor
(E6xxx and E4xxx series) feature 2MB L2 cache
memories while the Intel® Pentium® Dual Core Processor
- E2xxx series CPUs support an L2 cache of 1MB.
The single-core Intel® Celeron® 4xx processors
feature a 516KB level two (L2) cache memory.
MEMORY DIMM SLOT POPULATION
Chassis Plans' TQ9 supports two types of memory
operations:
Interleaved Mode - This is the mode of operation
that enables the highest memory interface speed
and bandwidth throughput capability. Often times
this mode of operation is referred to as "dual-channel
mode". Interleaved mode occurs when using two
or four DIMM modules with equal memory capacities.
The DIMM technology and device width can vary
but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used
in each channel then the slowest DIMM will determine
the memory interface speed.
Asymmetric Mode - From a system operational standpoint,
asymmetric mode functions as a "single-channel"
memory interface. Asymmetric mode occurs when
using either a single DIMM module or DIMM modules
with unequal memory capacities The DIMM technology
and device width can vary in each channel and
if different speed DIMMs are used in each channel
then the slowest DIMM will determine the memory
interface speed.
A memory module can be installed in only one DIMM
socket. If only one DIMM module is used, it must
be populated in either DIMM socket BKA1 or BKB1.
The TQ9's memory interface operates at maximum
bandwidth with two DIMMs of the same size installed
in DIMM Socket BKA1 and BKB1, but the DIMMs may
differ in technology (component density) and/or
device width. Populating identical DIMMs in all
four DIMM sockets will also achieve maximum memory
bandwidth operation.
To ensure maximum system performance and reliability,
Chassis Plans recommends using DIMMs that support
the Serial Presence Detect (SPD) data structure.
NOTE 1: Double-sided DIMMS with a x16 organization
are not supported.
NOTE 2: To minimize memory channel errors regardless
of the type of memory module used; Chassis Plans
recommends memory DIMMs with a memory clock cycle
specification of ten (10).
POWER REQUIREMENTS
Typical Values - CPU Idle State:
| CPU Speed |
Intel® No. |
+5V |
+12V |
+3.3V |
| 2.83GHz# |
Q9550 |
1.10A |
1.75A |
2.30A |
| 3.00GHz |
E8400 |
1.10A |
1.25A |
2.30A |
| 2.13GHz |
E6400 |
1.10A |
1.10A |
2.30A |
| 1.80GHz |
E4300 |
1.10A |
1.00A |
2.30A |
| 2.0GHz* |
440 |
1.00A |
0.90A |
2.30A |
Typical Values - 100% CPU Stress State:
| CPU Speed |
Intel® No. |
+5V |
+12V |
+3.3V |
| 2.83GHz# |
Q9550 |
1.20A |
4.50A |
2.40A |
| 3.00GHz |
E8400 |
1.20A |
3.75A |
2.40A |
| 2.13GHz |
E6400 |
1.20A |
2.10A |
2.40A |
| 1.80GHz |
E4300 |
1.20A |
2.00A |
2.40A |
| 2.0GHz* |
440 |
1.20A |
1.90A |
2.40A |
-12V @ <100mA
Tolerance for all voltages is +/- 5% and must
be applied by the PICMG 1.3 backplane to edge
connector C.
All processors listed are dual core CPUs except:
(#) quad-core [Yorkfield] Intel® Core 2™
and (*) single-core Intel® Celeron®.
OPERATING TEMPERATURE
(Standard Cooling Solution)
Operating Temperature: 0° to 60° C. (Celeron 440
CPU)
Operating Temperature: 0° to 50° C. (All other
processors)
OPERATING TEMPERATURE
(Low-profile Cooling Solution)1
Operating Temperature: 0° to 55° C. (Celeron 440
CPU)
Operating Temperature: 0° to 45° C. (All dual-core
processors)
Operating Temperature: 0° to 40° C. (All quad-core
processors)
1Contact Chassis Plans for information
on ordering the TQ9 with the low profile cooling
solution.
OTHER ENVIRONMENTAL REQUIREMENTS
Storage Temperature: -40° to 70° C.
Humidity: 5% to 90% non-condensing
MECHANICAL
The standard cooling solution used on the TQ9
SHBs enables placement of option cards approximately
2.48" (62.99mm) away from the top component side
of the SHB.
An optional lower profile cooling solution is
available that allows the placement of option
cards approximately 2.20" (55.88mm) away from
the top component side of the SHB.
The TQ9's overall dimensions are 13.330" (33.858cm)
L x 4.976" (12.639cm) H. The relative PICMG 1.3
SHB height off the backplane is the same as a
PICMG 1.0 SBC due to the shorter PCI Express backplane
connectors.
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PCI EXPRESS™ INTERFACES
Chassis Plans' TQ9 graphics-class single board
computer or system host board provides one x16
PCI Express link on the SBC's edge connectors
A and B. A x4 PCI Express link and five PCI Express
reference clocks are also included on edge connectors
A and B. An additional x1 PCI Express link and
reference clock between the TQ9 and backplane
can be provided by Chassis Plans' optional IOB3x
I/O Expansion Module. The PCI Express links are
used on SHB Express backplanes to support PCI
Express option cards and the bridge chips that
provide PCI/PCI-X option card support. During
system initialization the TQ9 automatically negotiates
with the PCI Express cards connected to the PCI
Express links in order to set up communication
between the devices. The net result is that the
TQ9 system host board supports communication to
x1, x4, x8 and x16 PCI Express boards as well
as PCI/PCI-X cards via PCI Express-to-PCI/PCI-X
bridge chip technology. The TQ9 also provides
a 32-bit/33MHz PCI bus interface on edge connector
D.
PCI EXPRESS™ CONFIGURATION
AND BUS SPEED
PCI Express -
Edge Connector A & B |
- One x16 link, one x4 or
four x1 links
- Five reference clocks |
| PCI Express - (via optional IOB31) |
- One x1 link and ref. clock |
| PCI - Edge Connector D |
- 32-bit/33MHz |
| System or FSB |
- 1333MHz, 1066MHz or 800MHz |
Notes:
1. The x16 link may be used for external PCI Express
video cards or to support general purpose PCI
Express cards in conjunction with the TQ9's internal
video port.
2. The x16 PCIe link on SHB edge connectors A
& B can not be bifurcated into multiple PCIe
links on a PICMG 1.3 backplane.
3. The x4 PCIe link on SHB edge connectors A &
B may be divided into four x1 PCIe links on a
PICMG 1.3 backplane.
VIDEO INTERFACES
The TQ9 supports three video connection options:
- Direct connection via the chipset's Intel®
Graphics Media Accelerator 3100 with faster
graphics and 3D performance
- An external video card installed in a backplane's
x16 PCI Express slot will use the TQ9's x16
PCIe link that provides 3.5 times more bandwidth
than an AGP 8X interface
- ADD2 video and graphic cards
AUDIO INTERFACES
The TQ9 supports two Audio interface connections:
- Intel® High Definition Audio - This digital
audio interface can be used to attach different
types of codecs; such as audio and modem codecs
to connector P40 of the TQ9. This audio link
operates 3.3 V and supports multi-channel
audio streams, a 32-bit sample depth, and
an audio sample rate up to 192 kHz.
- Analog Audio - The TQ9's analog audio connector
(P9) supports microphone input and HP-out
audio functions.
BIOS (FLASH)
The TQ9 uses AMIBIOS8®. The flash BIOS resides
in the Firmware Hub (FWH). AMIBIOS8 contains features
such as:
- Support for flash devices for BIOS upgrading
- Integrated support for USB mass storage
devices such as USB CD-ROM, CD-RW, etc.
- Boot from network, USB mass storage devices,
IDE or ATAPI
- Serial port console redirection to support
headless operation (requires optional IOB30
or IOB31)
- SATA/ATA/ATAPI support includes 48-bit LBA
addressing to support SATA/ATA/IDE hard drive
capacities over 137GB
IOB30MC/IOB31 EXPANSION BOARD
(OPTIONAL)
This optional board provides legacy I/O connections
via the Super I/O controller (LPC47B272). The
IOB30's I/O controller connects to the TQ9's LPC
Bus via the board's controlled impedance connector.
The following I/O interfaces are supported by
the TQ9 via either the IOB30MC or IOB31:
- SERIAL INTERFACE
The Super I/O controller supports two full-function
serial ports with independently programmable
baud rates. The controller has two high-speed,
NS16C550 compatible UARTs with Send/Receive
16-byte FIFOs. The IRQ for each serial port
has BIOS selectable addressing.
- FLOPPY DRIVE INTERFACE
The IOB30 supports up to two floppy disk drives
in combinations of 360K to 2.88MB.
- KB AND PS/2 MOUSE INTERFACES
The mini DIN connector located on the I/O
bracket provides an external interface for
a PS/2 mouse and keyboard. A "Y" adapter plugged
into the mini DIN connector allows the PS/2
mouse and keyboard to share the same port.
Internal PS/2 mouse and keyboard headers are
also available. A self-resetting fuse protects
the +5V line of the keyboard and the mouse.
- PARALLEL INTERFACE
The parallel port interface is compatible
with IBM PC/XT®, PC/AT®, PS/2TM, Enhanced
Parallel Port (EPP1.7, EPP1.9) and Extended
Capabilities Port (ECP) modes of operation.
Both the EPP and ECP modes are IEEE 1284 compliant.
The parallel port has BIOS selectable addressing.
The IOB31 supports all
of the same I/O functions as the IOB30MC
using cable header connectors. There is no I/O
plate on the IOB31. The IOB31 also provides a
x4 PCI Express edge connector designed to fit
into a PCI Express expansion slot on a PICMG 1.3
backplane. When used on the TQ9 system host board,
the IOB31 provides an extra x1 PCI Express link
to the backplane.
Operating systems exhibit certain boot-up behaviors
in regards to the handling of keyboard controller
functions that may necessitate the addition of
the IOB30 or IOB31 to the TQ9.
The operating systems that Chassis Plans has tested
that do not require the IOB30MC or IOB31
are:
- Microsoft® Windows® Vista Business & Ultimate
- Microsoft® Windows® XP Professional
- Microsoft® Windows® 2000 Professional
- Microsoft® Windows® 2003 Enterprise Server
- RedHat Enterprise Linux 5.0
- Fedora 7.0
- SUSE Enterprise Linux 10.0
The operating systems that Chassis Plans has tested
that require the IOB30MC or IOB31 in order to
provide required PS/2 keyboard functions is:
- Sun® Solaris™ 10.0
- Previous Linux versions
BATTERY
Built-in lithium battery for data retention of
CMOS memory.
WATCHDOG TIMER
The programmable watchdog timer is supported directly
by the I/O Controller Hub. Two operating modes,
free-running and one-shot, are available with
this two-stage watchdog timer. Stage one can generate
IRQ, SMI or SCI, and stage two generates a programable
watchdog timer reset with a total range of 1ms
to 10 minutes.
AGENCY APPROVALS & INDUSTRY
COMPLIANCE
Designed for UL60950, CAN/CSA C22.2 No. 60950-00,
EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997,
EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996,
EN61000-4-11:1994
MEAN TIME BETWEEN FAILURES
(MTBF)
TBD POH (Power-On Hours) at 40 °C., per Bellcore
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MODEL
NAME: TQ9 |
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| MODEL# |
MODEL NAME |
SPEED* |
INTEL PROCESSOR
NAME & NUMBER |
EMBEDDED |
| Quad-Core
Processor Options |
| S6731-426-xM |
TQ9/2.83QP12 |
2.83GHz |
Intel® Core™ 2
Processor Q9550 |
No |
| S6731-425-xM |
TQ9/2.66QP12 |
2.66GHz |
Intel® Core™ 2
Processor Q9450 |
No |
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| Dual-Core
Processor Options |
| S6731-129-xM |
TQ9/3.0DP6 |
3.0GHz |
Intel® Core™ 2
Processor E8400 |
Pending |
| S6731-022-xM |
TQ9/2.13DP2 |
2.13GHz |
Intel® Core™ 2
Duo Processor E6400 |
Yes |
| S6731-012-xM |
TQ9/1.8DV2 |
1.8GHz |
Intel® Core™ 2
Duo Processor E4300 |
Yes |
| S6731-002-xM |
TQ9/1.8D1 |
1.8GHz |
Intel® Pentium® Dual
Core Processor E2160 |
Yes |
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| Single-Core
Processor Option |
| S6731-503-xM |
TQ9/2.0SC |
2.0GHz |
Intel® Celeron® Processor
440 |
Yes |
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* Contact Chassis Plans for the latest processor
speed and availability.
The stated bus speed, memory and communication
interface speeds are component maximums; actual
system performance may vary. |
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TQ9
COMPATIBLE BACKPLANES
GRAPHICS CLASS PICMG 1.3
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| BPG6741 |
1 x16 and 2 x1 PCI Express (PCIe) slots |
| BPG6714 |
1 x16 and 1 x4/x1 PCIe slot, 1 PCIe expansion
slot and 3 PCI-X/PCI slots |
| BPG6615 |
1 x16 and 4 x4 PCIe slots and 6 PCI-X/PCI
slots |
| BPG6600 |
1 x16 and 1 x4/x1 PCIe slot, 1 PCIe expansion
slot, 6 PCI-X/PCI slots and 4 PCI 32-bit/33MHz
PCI slots |
| BPG6544 |
1 x16 and 1 x4/x1 PCIe slot, 1 PCIe expansion
slot, 5 PCI-X/PCI slots, 2 32-bit/33MHz
PCI slots and 2 ISA slots |
| BPG4 |
1 x16 and 2 x4/x1 PCIe slots and 1 PCIe
expansion slot |
| BPG2/2 |
1 x16 PCIe slot and 2 PCI-X slots |
*Contact Chassis Plans if you do not
see the backplane slot
configuration needed for your application |
TQ9 Datasheet - Click
Here
TQ9 Technical Reference - Click Here
TQ9 Reference Manual in PDF - Click Here
SBC Support Page - Click
Here |
